The IEC 60352-5 standard, titled "Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance," is the definitive international document governing press-fit technology in electronics. It establishes the mechanical, electrical, and environmental criteria necessary to ensure reliable, solderless joints between connector pins and board holes. Overview of the Latest Edition (2020)
As PCB densities increase and lead-free requirements evolve, following IEC guidelines iec 603525 pdf
Key "good features" and highlights from the latest version ( IEC 60352-5:2020 ) include: 1. Expanded Scope for Modern Materials Non-PCB Substrates The IEC 60352-5 standard, titled "Solderless connections -
Press-in technology reduces thermal stress on components and simplifies the recycling process by avoiding complex soldering chemicals. Why it Matters: IEC 60352-7: Solderless connections — Part 7: Spring
It is important to clarify right away that there is no IEC standard with the number "603525".
Each Part 2 modifies, replaces, or adds to Part 1. For example:
Removed fixed tables for board hole dimensions (as legacy technologies like wire-wrapping became obsolete), granting more design freedom. Edition 3.0